Application of organosilicon thermal conductivity materials in automotive electronic devices

Cars on the road will be subjected to wind, sand, rain, snow, high and low temperature, vibration and other types of weather and pollution erosion, therefore, a variety of fine electronic control modules must be protected by appropriate protective materials to ensure its stability and reliability. In the field of automotive electronic applications, the selection of protective materials in addition to the basic requirements of insulation, thermal conductivity, moisture, pollution, corrosion, and other characteristics, special requirements have low stress and heat resistance, cold resistance and other properties.

1. Heat-conducting silicone potting glue:

It is used for all kinds of control modules, and the components are sealed as a whole in one time, so as to meet the basic requirements of moisture-proof, anti-fouling and anti-corrosion. The use of silicone thermal sealing adhesive can reduce stress and withstand high and low temperature impact function, high power control module to achieve heat dissipation function. ABS sensor and power system module and other devices because the internal components will heat, so it is also required that the heat-conducting silicone potting adhesive should be UL94V-0 flame retardant level. Tis 680-28AB two-component thermal potty adhesive is very good for ABS sensors.

2. Thermal gel:

For some irregular heating elements may be somewhat helpless, so thermal gel can be a good solution to the situation. Thermal gel has good thermal stability and electrical insulation, flexible, elastic characteristics make it can be used to cover very uneven surface, and after curing does not produce small molecules, can reduce the temperature and external pressure, in the liquid form, to provide a variety of thickness. It can meet the requirements of vertical shock and vibration in automobile industry, and greatly reduce the stress on components in the assembly process.

3, thermal interface material:

There are many high-power components in various electronic control modules, which will generate a lot of heat in use, which makes the temperature of the module gradually rise in the work. To avoid damage to components and circuits caused by high temperature, you must solve heat dissipation methods to maintain the normal operation of the control module. No matter what kind of heat dissipation method is used, the thermal conductive interface material must be used as the medium to reduce the interface thermal contact resistance and increase the heat dissipation efficiency. It includes thermal conductivity potting glue, thermal conductivity gel material and other thermal conductivity materials.